Download Coombs' Printed Circuits Handbook by Clyde Coombs, Happy Holden PDF

By Clyde Coombs, Happy Holden

Get to the bottom of your entire workaday questions with the PCB resolution book.

Defining the easiest in published circuit board layout and know-how and extraordinary in thoroughness and reliability, Coombs' revealed CIRCUITS guide, 5th version offers definitive assurance of each part of revealed circuit assemblies, from layout ways to production approaches. This new version of the main relied on consultant to pcbs promises:

* Exhaustive assurance of HDI (High Density Interconnect) applied sciences together with layout, fabric, microvia fabrication, sequential lamination, meeting, trying out, and reliability * insurance of fabrication advancements together with: blind and buried vias, managed intensity drilling, direct imaging, horizontal and pulse plating * Thorough exam of base fabrics, together with conventional and replacement laminates * realizing of potent caliber and reliability courses, together with: attempt & inspection, acceptability standards, reliability of forums and assemblies, approach power and keep watch over * complete therapy of multi-layer and versatile revealed circuit layout, fabrication and meeting complicated unmarried- and multi-chip part packaging * Contributions from execs at Motorola, Cisco, and different significant businesses * integrated CD-ROM, with the whole e-book in searchable layout * enormous quantities of illustrations and instant-access tables, and formulation

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Extra resources for Coombs' Printed Circuits Handbook

Example text

Same RISC processor as MCM-L (1991) (4"x4" 10 layer-TH/Bv seq. lam) c. 3 Example of the same computer CPU board as it used alternative component, assembly, and PWB technologies. (a) Size and appearance of each generation. (b) Movement of total board density from traditional to HDI. (c) HDI. A 14-layer board through-hole with a surface area of 128 in2 in 1986 (Fig. 3[a]) to A 10-layer surface-mount technology board with a surface area of 16 in2 in 1991 (Fig. 3[b]) to A high-density interconnect board with sequential build-up microvias, buried and blind vias, and a surface area of 4 in2 in 1995 (Fig.

1 INTRODUCTION All electronic components must be interconnected and assembled to form a functional and operating system. The design and the manufacture of these interconnections have evolved into a separate discipline called electronic packaging. Since the early 1950s, the basic building block of electronic packaging is the printed wiring board (PWB), and it will remain that into the foreseeable future. This book outlines the basic design approaches and manufacturing processes needed to produce these PWBs.

With the introduction and continued refinement of such packaging techniques as the ball grid array (BGA), chip-scale packaging (CSP), and chip-on-board (COB), traditional PWB technology has approached a point where alternative ways of providing high-density interconnection have had to be developed. (See Chaps. 2 and * Adapted from Coombs, Clyde F. ), chap. ) This has been called at times high-density interconnects (HDI), the interconnection revolution, or the density revolution, because doing the same things in the same way, only smaller, was no longer sufficient.

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