Download LED Packaging for Lighting Applications: Design, by Sheng Liu, Xiaobing Luo PDF

By Sheng Liu, Xiaobing Luo

Because the first light-emitting diode (LED) used to be invented by means of Holonyak and Bevacqua in 1962, LEDs have made amazing development some time past few a long time with the quick improvement of epitaxy progress, chip layout and manufacture, packaging constitution, methods, and packaging fabrics. LEDs have more advantageous features equivalent to excessive potency, small measurement, lengthy existence, low strength intake, and excessive reliability. the marketplace for white LED is turning out to be swiftly in a number of functions. it's been commonly accredited that white LEDs could be the fourth illumination resource to alternative the incandescent, fluorescent, and high-pressure sodium lamps. With the improvement of LED chip and packaging applied sciences, the potency of excessive energy white LED will increase the applying markets of LEDs whereas altering the lights suggestions of our lives.

In LED Packaging for lighting fixtures Applications, Professors Liu and Luo hide the complete spectrum of layout, production, and trying out. Many ideas are proposed for the 1st time, and readers will enjoy the concurrent engineering and co-design ways to complicated engineering layout of LED items.

  • One of the single books to hide LEDs from package deal layout to production to checking out
  • Focuses at the layout of LED packaging and its purposes resembling highway lighting
  • Includes layout tools and reports beneficial for LED engineers, in particular optical and thermal layout
  • Introduces novel LED packaging constructions and production procedures, akin to ASLP
  • Covers reliability concerns, the main demanding challenge for the LED
  • Provides dimension and checking out criteria, that are serious for LED improvement, for either LED and LED furniture
  • Codes and demonstrations on hand from the book’s better half web site

This e-book is perfect for working towards engineers operating in layout or packaging at LED businesses and graduate scholars getting ready for paintings in undefined. This e-book additionally offers a valuable creation for complicated undergraduates, graduates, researchers, lights designers, and product managers drawn to the basics of LED layout and creation.

colour model of chosen figures are available at www.wiley.com/go/liu/ledContent:
Chapter 1 advent (pages 1–32):
Chapter 2 basics and improvement tendencies of excessive strength LED Packaging (pages 33–66):
Chapter three Optical layout of excessive energy LED Packaging Module (pages 67–148):
Chapter four Thermal administration of excessive energy LED Packaging Module (pages 149–165):
Chapter five Reliability Engineering of excessive strength LED Packaging (pages 167–214):
Chapter 6 layout of LED Packaging functions (pages 215–315):
Chapter 7 LED dimension and criteria (pages 317–330):

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Additional info for LED Packaging for Lighting Applications: Design, Manufacturing and Testing

Sample text

At the same time, the luminous intensity or optical power output of the LED changes with the wavelength. 12. When the curve is established, the related chromaticity parameters such as the device’s dominant wavelength, color purity, and so on are then determined. The LED spectral distribution is dependent on the type, the property and structure of P–N junction, such as the epitaxial layer thickness, doping impurities, and so on of the compound semiconductor used in preparation, but has nothing to do with the device’s geometry and package.

Suski, T. and Teisseyre, H. (1995), “Towards the Identification of the Dominant Donor in GaN,” Physics Review Letters 75: 296–310. I. E. (1974), “Properties of Zinc-doped GaN. II. photoconductivity,” Journal of Applied Physics 45: 3892–3896. , Santic, B. and Schlotter, P. 8 eV photoluminescence band in Mg doped GaN,” Applied Physics Letters 72(11): 1326–1329. , Akutsu, N. and Matsumoto, K. (1998), “Growth condition dependence of Mg-doped GaN film grown by horizontal atmospheric MOCVD system with three layered laminar flow gas injection” Journal of Crystal Growth, 189/190: 519–522.

With the increasing frequency in RF circuits, coupling for multiple physical variables exists and co-design for all these variables is essential for complex systems. It is also equally important that the designs need validation by tools, some of which are in place, while others may still need development. All these issues have been discussed in a number of books and one such book is by Suhir et al. [2]. 2 Wafer Level Packaging, More than Moore, and SiP In our definition above, packaging is defined as a system itself and it may be used as a device, a module, or a system.

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