By Clyde Coombs, Happy Holden
Руководство по печатным платамThe up to date revealed Circuits instruction manual provide you with: Unsurpassed information on published circuits from layout to production. Over 500 illustrations, charts, and tables for speedy entry to crucial facts. New to this variation: New assurance of lead-free PCB layout and production thoughts, lead-free fabrics, lead-free reliability types, top practices for prime Density Interconnect (HDI), and versatile revealed circuits.
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Extra info for Printed Circuits Handbook
Chapter 45 on “Soldering Materials” lists and describes alternative materials to tin-lead solder. Chapters 58 and 59 on “Reliability” provide information on methods to predict product life. 2). 2 Analysis for RoHS Compliance The directive focuses on the smallest homogeneous part or material that can be separated from the mass of a component or assembly. As an example, take the case of a plastic packaged integrated circuit (IC) with a copper (Cu) lead-frame, where the lead-frame is plated with some surface finish for solderability.
Radios, televisions, cameras, audio equipment, musical instruments, etc. Light bulbs, lamps, other lighting equipment, etc. Tools for drilling, sawing, sewing, turning, milling, sanding, grinding, cutting, shearing, making holes, punching, folding, bending, riveting, nailing, welding, soldering, etc. ; sports equipment with electric or electronic components; slot machines; etc. Equipment for radiotherapy, cardiology, dialysis, and nuclear medicine; pulmonary ventilators; laboratory equipment for in vitro fertilization, diagnosis, analyzers, freezers, etc.
3. 3 Spacing Required Between Chips Attachment method Chip spacing, mils Flip-chip Wire-bonding Flip TAB Regular TAB 15–20 70–80 100–120 150–400 It is apparent that direct chip attach on PWBs will result in the significant reduction of the packaging efficiency of such assemblies, except for the fact that components can be mounted on both sides of the PWB substrate. It has been shown that wire-bonding can be done on both sides of a PWB with some special fixturing; also, outer lead bonding (OLB) of TABs can be done on both sides of the PWB substrate.